6g

This is a special, bonus episode of The McKinsey Podcast. McKinsey Partner Ferry Grijpink joins host Roberta Fusaro from the annual Mobile World Congress in Barcelona.

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En el mes de febrero y marzo de 2022, recién iniciado el conflicto entre Rusia y Ucrania, comenzó a circular un documento elaborado por la RAND Corporation en 2019 denominado ´´Extending Russia – Competing from Advantageous Ground’’ el cual indicaba abiertamente ser patrocinado por la Oficina de Revisión de Defensa Quadrienal del Ejército y la Oficina del Subjefe de Estado Mayor G-8 de Estados Unidos. A su vez, dicho documento indicaba que su propósito era examinar una gama de posibles medios y escenarios probabilísticos sobre la extensión de influencia territorial de Rusia y la definición de medidas, no necesariamente violentas, que podrían estresar al ejército o la economía rusa así como su posición e injerencia política a lo interno del propio país y el extranjero, con el fin de contener dicha expansión. Lo curioso de dicho documento es que aparentemente pronosticaba de una forma muy detallada, las características del conflicto que recientemente había explotado entre Rusia y Ucrania en febrero.

Gerson Freire (Dell) e José Felipe Ruppenthal (Kyndryl) falam sobre as novidades do mundo de telecom que foram apresentadas durante o Mobile World Congress, o maior evento desse tema no mundo. Nessa conversa, falamos sobre diversos pilares envolvem este setor, como o 5G, 6G, edge computing e, é claro, o papel da sociedade.

What happens when you need to start thinking like an infrastructure company rather than a telecommunications service provider? Aurecon's Simon McFadden, speaks to Amplitel CEO Jon Lipton about creating a national specialist tower company following the partial sale of Telstra’s tower business. Find out how Amplitel is developing a digital twin network across its 8,000 tower sites and investing in new tower technology, particularly with the emerging rollout of 6G.

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V našem prvním veřejném (beta) podcastovém experimentu si šéfredaktor INSIDE IT Lukáš Erben a exekutivní partner Gartneru Vašek Špáňa povídají o novinkách ze světa generativní AI (slona v místnosti jménem ChatGPT nevyjímaje), sítích 6G, pokutách za GDPR a propouštění v SAP.

In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting. 

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies, which the duo published in 2019. This book picks up where the first one left off, with 11 new chapters including contributions from some of the same companies that participated before, as well as new ones. 

 The book examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges, and is filled with contributions from some of the field’s leading experts.

In the interview, Beth talks about the book’s backstory, why and how it was written, and who participated. She also explains why they decided to begin the book with a market report, and how the book is a snapshot in time. 

Contact Beth Keser on LinkedIn

Order your own copy of Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces.

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

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According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. But there are a lot of challenges to iron out before EVs achieve critical mass. For example, one area of interest for this week’s podcast guests is the materials used to manufacture EV power modules. 

In this episode, Françoise von Trapp talks with Indium’s Pei Lim and Dean Payne about these challenges, particularly why pressure silver sintering is becoming a popular approach for die attach in power packaging applications. 

 You’ll learn how eMobility has impacted manufacturing power modules and the origin of silver sintering in these devices. You’ll learn about the materials currently used in sintering, and why silver is a better choice for electric vehicles. Lastly, you’ll learn about Indium’s pressure sinter offering and its benefits. 

Learn more about pressure silver sintering here. 

Contact today’s guests on LinkedIn:

 Sze Pei Lim, Senior Global Product Manager, Indium Corporation 

Dean Payne, Semiconductor Product Manager, Indium Corporation.

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For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca.

Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions and personal stories, including Jean Trewhella, GlobalFoundries; Susan Trulli, Raytheon; Shelby Nelson, Mosaic Microsystems; Urmi Ray, Saras Micro Devices, and KT Moore, Cadence. 

Davis provided a framework for the conversation, explaining the difference between Equal and Equity: Equality means each employee gets the same bicycle to ride, and equity means that everyone gets the bicycle that suits their needs. The panelists then also offered tips for how to overcome our own unconscious bias to create a culture of DEI at our own workplaces.

Contact the Panelists on LinkedIn
Robin Davis, Deca
Jean Trewhella, GlobalFoundries
Susan Trulli, Ratheon
Shelby Nelson, Mosaic Microsystems
Urmi Ray, Saras Microdevices
KT Moore, Cadence 

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25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week. 

 Craig North, of Gel-Pak, is on a mission to find out as much as he can about chiplet processes and technology, to identify gaps that can be filled by Gel Pak products and services. 

 Bob Connor and Kevin Oswalt of X-Celeprint. Kevin talked about the paper he presented at IMAPS on micro-transfer printing (MTP) at the conference and creating the III_V heterogeneous integration ecosystem. 

Bill Acito, of Member company Siemens, presented on silicon substrate design for BGA designers.

 Carlotta Baumann, the new CEO of Finetech, talks about stepping into the role in the midst of COVID, and into the shoes of a 22-year veteran not only as a woman but as the sole owner of the company.

Tim Olson, CEO of Deca, was awarded the IMAPS Founder Award. To celebrate, we took a walk down memory lane to share Deca’s origin story and how the company has evolved over the years. 

Casey Krawiec and Tim Going of StratEdge Corporation,  talked about the new die-on-tab service they are offering for customers who want to incorporate GaAn die into hybrid packaging. They’ve got some interesting products coming down the pipelines in space and defense applications. 

Keith Best, of our member company Onto Innovation, talked about the company’s presentation on RDL inspection, which is difficult to inspect because of metal grain. He explained how Onto Innovation’s ClearFind technology uses a green laser to make metal black and organics white, to make the defects easier to see. 

Dick Otte,

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in this episode, Françoise von Trapp interviews three of the keynote speakers who presented during the 2022 IMAPS International Symposium. Featured guests include Lionel Kimmerling, Dr. Anu Agarwal (MIT Microphotonics Center); Glenn Daves (NXP), and Dave Bolognia (Analog Devices).

We’re back on the road – recording a series of episodes at the IMAPS International Symposium. In this first episode, Françoise interviews some of the keynote speakers to capture the highlights of their talks. 

First up, is Lionel Kimmerling, Thomas Lord Professor of Materials Science and Engineering Director at MIT Microphotonics Center, and his colleague, Dr. Anu Agarwal, MIT – Director of Electric Photonic Packaging and principal research scientist. They explain the basics of Si photonics and co-packaged optics, and the advantages and opportunities of electronic-photonic package integration, which is expected to be the next big technology transition in the IC field, particularly when it comes to chip stacking.  

Additionally, Dr. Agarwal talks about a partnership between the Microphotonics Center and IMAPS to provide an educational setting to provide hands-on-training to help the packaging engineer workforce to develop the new skills 

 Glenn Daves of NXP gave the keynote on Day 2 on the topic of 6G – It’s Opportunities and Packaging Challenges. He talks about the promise of 6G and why it’s more than just another “G” and explains what the plans are for 6G applications. We also talk about all that needs to be accomplished to stay on track to integrate 6G into the wireless offerings, and what’s needed specifically from the packaging community t support it. Lastly, he talks about the importance of semiconductor sustainability and the opportunity to design sustainability into 6G from the get-go. 

 Dave Bolognia of Analog Devices talks about advancing medical electronics at the intelligent edge. He explains what he means by the intelligent edge; how data volumes are driving the need for more processing at the edge, and the medical applications that will benefit from it. 

Contact Our Guests:

 Lionel Kimmerling, MIT Microphotonics Center

Anu Agarwal, Ph.D., MIT Microphotonics Center 

Glenn Daves, NXP Semiconductors

Dave Bolognia, Analog Devices 

Become a sustaining member!

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

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Mi az 5G? Mi a különbség az 5G és a 4G között? Mekkora szerepe van az 5G-nek a lakossági internetfelhasználásban? Hogyan kapcsolódik össze az Ipar és az 5G? Miért elengedhetetlen a nagysebességű internet a gép-gép kommunikációban? Hogyan küzd a tudományos világ az összeesküvés elméletek ellen? Mennyi szenzor van körülöttünk? Hogyan lehet feldolgozni és hasznosítani a hatványozott adatmennyiséget? Mikor jön el a 6G?

5G will have a significant impact on supply chains. Public 5G networks are being rolled out right now by many mobile operators, and it's also possible to roll out private 5g networks.

To find out more about the implications for supply chains I invited Karin Loidl from the Fraunhofer IIS to come on the podcast.

We had a fascinating conversation covering why 5G is so important, some of the use cases (including when to use 5G, and when to use wifi), and the timeframe for the different 5G version rollouts (and 6G and onwards!).

I learned loads, I hope you do too...

Here are some of the links that Karin referred to in the podcast:

• 5G Bavaria Testbed Industry 4.0 (Karin's home base) 
• 5G Positioning 
• 5G Positioning in Industry and Logistics 
• 5G Bavaria Testbed Automotive 
• 5G connect (Event) 

If you have any comments/suggestions or questions for the podcast - feel free to leave me a voice message over on my SpeakPipe page or just send it to me as a direct message on Twitter/LinkedIn. Audio messages will get played (unless you specifically ask me not to).

If you want to learn more about how to juggle sustainability and efficiency mandates while recovering from pandemic-induced disruptions, meeting growth targets, and preparing for an uncertain future, check out our Oxford Economics research report here.

And if you want to read up on our Industry 4.0 blueprint repost, head on over to https://www.sap.com/cmp/dg/intro-industry40/index.html, and if you liked this show, please don't forget to rate a

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And remember you too can Support the Podcast - it is really easy and hugely important as it will enable me to continue to create more excellent Digital Supply Chain episodes like this one.

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Raza Khan is an Engineer and Senior Market Manager for Wireless Products in Semtech’s Signal Integrity Products Group (https://www.semtech.com/products/signal-integrity), and has over 15 years of experience in the semiconductor industry. In his current role, he oversees the strategy, product line development and market development for integrated circuit (IC) solutions for optical transport needs within the wireless market. This includes the Tri-Edge™ 50G PAM4 product portfolio and ClearEdge® 25G product portfolio for the emerging 5G wireless market, as well as the FiberEdge™ 10G product portfolio for the 4G wireless market. Mr. Khan holds a Bachelor of Science degree in Electrical Engineering from Western University and a double major Masters of Business Administration in Strategic Marketing and Management of Innovation and Technology (MINT) from McMaster University. Semtech Corporation (https://www.semtech.com/) is a leading global supplier of high performance analog and mixed-signal semiconductors and advanced algorithms for infrastructure, high-end consumer and industrial equipment. Products are designed to benefit the engineering community as well as the global community. The Company is dedicated to reducing the impact it, and its products, have on the environment. Internal green programs seek to reduce waste through material and manufacturing control, use of green technology and designing for resource reduction.

Toda historia tiene un antecedente. Un origen a veces difuso que se escapa a la mayoría. El tiempo juega con nuestra percepción y así medimos y juzgamos las realidades más cercanas según los acontecimientos más recientes. Aquellos acontecimientos que sí se nos son revelados y están a nuestro alcance. Pocos tienen acceso a los entresijos históricos y a aquellas huellas que si no fuera por las crónicas de la época, se perderían para siempre. 

En el caso de las guerras, pocas veces suceden por solo un factor aislado, sino que por el contrario, son fenómenos multidimensionales y archi complejos, compuestas de diferentes capas de profundidad y en la cual intervienen una miríada de intereses y figuras. 

Abramos nuestros oídos, ojos, alma y mente. Permitámonos dar paso al pensamiento crítico y rebusquemos en los orígenes del conflicto. Por primera vez, hagamos el esfuerzo por leer el PREÁMBULO de esta novela de terror. 

La historia está plagada de medias verdades y nosotros las consumimos constantemente. Las aceptamos como inequívocas y las replicamos. No solo ello, sino que nos encargamos de esparcirlas y acrecentarlas. Alguien dijo que una verdad es solamente una mentira repetida muchas veces, e incluso… una mentira con el marketing correcto. 

De hecho, hoy estamos expuestos más que nunca a una maquinaria propagandística de intereses difusos, que emplea todo medio de comunicación disponible, incluidas las redes sociales, para lograr sus cometidos. Y cuáles son esos cometidos, pues colocar en nuestros idearios ‘’una verdad’’…, ‘’su verdad’’. Y quiénes son ellos? Pues cualquiera con el poder y la capacidad monetaria suficiente para mover los entramados de la industria mediática, de comunicación y publicidad. Gobiernos, redes institucionales, empresas privadas, organizaciones no gubernamentales…, en fin. 

El 24 de febrero de 2022, pocos minutos antes de las 6 de la mañana, Vladímir Vladímirovich Putin, presidente de la Federación Rusa lanzaba de manera oficial una ‘’operación militar especial’’ en la región de Dombás, Ucrania, y casi simultáneamente se registraban fuertes explosiones en varios puntos del este de dicho país, desde Sloviansk y Kramatorsk a Járkov, a 30 kilómetros de la frontera rusa. Así daba inicio un cruento enfrentamiento entre el ejército ruso y la fuerza armada ucraniana, ambos bandos denominando a sus correspondientes cuerpos políticos como ‘’regímenes no democráticos y autoritarios’’.  Así se iniciaba un nuevo conflicto entre Ucrania y Rusia que será considerado sin lugar a dudas por el revisionismo histórico como el punto álgido y focal del quiebre civilizatorio de nuestra era pos pandemia. Punto de quebranto que realineará las fronteras conocidas y la política exterior de los herederos de Yalta. Acontecimiento que redefinirá las afinidades entre los países generando sin duda un choque entre globalismo y regionalismo, enfrentándose nuevamente Occidente con Oriente, ya no por diferencias ideológicas, sino por el choque de dos proyectos globales contrarios y cosmovisiones diametralmente opuestas.