imaps international symposium 2022

In this episode, Françoise speaks with Beth Keser, Ph.D., about her latest book co-authored with Steffen Kröhnert, ESPAT Consulting. 

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces was published in December 2021. It is essentially a companion to the wafer-level packaging handbook titled, Advances in Embedded and Fan-Out Wafer-Level Packaging Technologies, which the duo published in 2019. This book picks up where the first one left off, with 11 new chapters including contributions from some of the same companies that participated before, as well as new ones. 

 The book examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges, and is filled with contributions from some of the field’s leading experts.

In the interview, Beth talks about the book’s backstory, why and how it was written, and who participated. She also explains why they decided to begin the book with a market report, and how the book is a snapshot in time. 

Contact Beth Keser on LinkedIn

Order your own copy of Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

According to the International Energy Agency, road transportation accounts for 16% of global emissions. Electric vehicles are the key technology to decarbonize this. The EIA estimates that EVs will account for 13% of new cars sold in 2022. Many countries are setting goals to eliminate combustion engine cars to reach Net Zero emissions by 2050. But there are a lot of challenges to iron out before EVs achieve critical mass. For example, one area of interest for this week’s podcast guests is the materials used to manufacture EV power modules. 

In this episode, Françoise von Trapp talks with Indium’s Pei Lim and Dean Payne about these challenges, particularly why pressure silver sintering is becoming a popular approach for die attach in power packaging applications. 

 You’ll learn how eMobility has impacted manufacturing power modules and the origin of silver sintering in these devices. You’ll learn about the materials currently used in sintering, and why silver is a better choice for electric vehicles. Lastly, you’ll learn about Indium’s pressure sinter offering and its benefits. 

Learn more about pressure silver sintering here. 

Contact today’s guests on LinkedIn:

 Sze Pei Lim, Senior Global Product Manager, Indium Corporation 

Dean Payne, Semiconductor Product Manager, Indium Corporation.

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

For this episode, recorded during the IMAPS International Symposium, Françoise von Trapp hands over the mike to Robin Davis, of 3D InCites Member company, Deca.

Davis organized and moderated a Diversity, Equity, and Inclusion town hall discussion during IMAPS, on the topic of Equality vs. Equity. A distinguished panel of industry veterans shared their perceptions and personal stories, including Jean Trewhella, GlobalFoundries; Susan Trulli, Raytheon; Shelby Nelson, Mosaic Microsystems; Urmi Ray, Saras Micro Devices, and KT Moore, Cadence. 

Davis provided a framework for the conversation, explaining the difference between Equal and Equity: Equality means each employee gets the same bicycle to ride, and equity means that everyone gets the bicycle that suits their needs. The panelists then also offered tips for how to overcome our own unconscious bias to create a culture of DEI at our own workplaces.

Contact the Panelists on LinkedIn
Robin Davis, Deca
Jean Trewhella, GlobalFoundries
Susan Trulli, Ratheon
Shelby Nelson, Mosaic Microsystems
Urmi Ray, Saras Microdevices
KT Moore, Cadence 

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

25 of our community members participated in the 2022 IMAPS International Symposium in Boston, MA, which was held during the first week of October. This episode features conversations about what they were presenting and showcasing, and what they learned during the week. 

 Craig North, of Gel-Pak, is on a mission to find out as much as he can about chiplet processes and technology, to identify gaps that can be filled by Gel Pak products and services. 

 Bob Connor and Kevin Oswalt of X-Celeprint. Kevin talked about the paper he presented at IMAPS on micro-transfer printing (MTP) at the conference and creating the III_V heterogeneous integration ecosystem. 

Bill Acito, of Member company Siemens, presented on silicon substrate design for BGA designers.

 Carlotta Baumann, the new CEO of Finetech, talks about stepping into the role in the midst of COVID, and into the shoes of a 22-year veteran not only as a woman but as the sole owner of the company.

Tim Olson, CEO of Deca, was awarded the IMAPS Founder Award. To celebrate, we took a walk down memory lane to share Deca’s origin story and how the company has evolved over the years. 

Casey Krawiec and Tim Going of StratEdge Corporation,  talked about the new die-on-tab service they are offering for customers who want to incorporate GaAn die into hybrid packaging. They’ve got some interesting products coming down the pipelines in space and defense applications. 

Keith Best, of our member company Onto Innovation, talked about the company’s presentation on RDL inspection, which is difficult to inspect because of metal grain. He explained how Onto Innovation’s ClearFind technology uses a green laser to make metal black and organics white, to make the defects easier to see. 

Dick Otte,

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

in this episode, Françoise von Trapp interviews three of the keynote speakers who presented during the 2022 IMAPS International Symposium. Featured guests include Lionel Kimmerling, Dr. Anu Agarwal (MIT Microphotonics Center); Glenn Daves (NXP), and Dave Bolognia (Analog Devices).

We’re back on the road – recording a series of episodes at the IMAPS International Symposium. In this first episode, Françoise interviews some of the keynote speakers to capture the highlights of their talks. 

First up, is Lionel Kimmerling, Thomas Lord Professor of Materials Science and Engineering Director at MIT Microphotonics Center, and his colleague, Dr. Anu Agarwal, MIT – Director of Electric Photonic Packaging and principal research scientist. They explain the basics of Si photonics and co-packaged optics, and the advantages and opportunities of electronic-photonic package integration, which is expected to be the next big technology transition in the IC field, particularly when it comes to chip stacking.  

Additionally, Dr. Agarwal talks about a partnership between the Microphotonics Center and IMAPS to provide an educational setting to provide hands-on-training to help the packaging engineer workforce to develop the new skills 

 Glenn Daves of NXP gave the keynote on Day 2 on the topic of 6G – It’s Opportunities and Packaging Challenges. He talks about the promise of 6G and why it’s more than just another “G” and explains what the plans are for 6G applications. We also talk about all that needs to be accomplished to stay on track to integrate 6G into the wireless offerings, and what’s needed specifically from the packaging community t support it. Lastly, he talks about the importance of semiconductor sustainability and the opportunity to design sustainability into 6G from the get-go. 

 Dave Bolognia of Analog Devices talks about advancing medical electronics at the intelligent edge. He explains what he means by the intelligent edge; how data volumes are driving the need for more processing at the edge, and the medical applications that will benefit from it. 

Contact Our Guests:

 Lionel Kimmerling, MIT Microphotonics Center

Anu Agarwal, Ph.D., MIT Microphotonics Center 

Glenn Daves, NXP Semiconductors

Dave Bolognia, Analog Devices 

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.