eu chips act

Françoise von Trapp and  SEMI Europe's Laithe Altimime discuss the status of the European Chips Act, which aims to double Europe's market share in global manufacturing by 2030 and increase chip production by 20%.

The discussion focuses on European industry growth and resilience, and the importance of collaboration. They also discuss  ISS Europe which takes place in Vienna, March 6-8, 2024, and how its content differs from SEMI ISS. 

This year's theme will focus on the microelectronics supply chain, sustainability, and workforce development. 

You'll learn about the importance of Europe's Chips Act in maintaining competitiveness and increasing strategic positioning in the global value chain.

You'll also better understand the need for a more resilient supply chain, particularly in light of geopolitical events and the chip shortage.

You'll learn,  in detail, about the workforce development challenges facing the entire semiconductor industry, and the approach the EU is taking to address them.

To learn more about ISS Europe 2024, and to register, visit the website.

Contact Laith Altimime on LinkedIn. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

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Heute u.A. mit diesen Themen:

• Niedrigere N26-Bewertung von 3 Milliarden US-Dollar
• Durchwachsene Zahlen bei Netflix
• EU: 1,1 Milliarden Euro für Cybersicherheit
• FTX: Wiederbelebung mit 250 Millionen US-Dollar?
• SpaceX: Heute erster Starship-Testflug
• Vorwürfe gegen Telefahr-Startup Vay
• EU-Abgeordnete wollen globales KI-Gipfeltreffen
• EyeEm vor dem Aus
• 43 Milliarden Euro durch EU Chips Act
• 6,5 Millionen Euro für Tanso

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This episode features interviews that were recorded live at IMAPS DPC 2023.  

 First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study. Joly is the partnerships manager for 3D integration and packaging at CEA Leti. She provides key takeaways from her talk.

Next up is Basam Ziadah, who presented his keynote, Driving Adoption of Advanced IC Packaging in Automotive Applications. He talks about what drives more semiconductor devices in automotive applications. He describes the challenges we need to address to deliver advanced technology with the level of reliability required by the automotive industry, and how chiplet integration can be used. 

 Lastly, Françoise interviews Nicholas Harris, CEO of Lightmatter, who presented on extending Moore’s Law with photonics packaging. He explains why chiplets aren’t the panacea everyone thinks, of and how 3D integration using photonics packaging is the way forward to achieve performance at low power for artificial intelligence and high-performance computing.

Episode Guests

·      Sylvie Joly, CEA-Leti

·      Basam Ziadeh, General Motors

·      Nicholas Harris, Lightmatter

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.