From IMAPS DPC 2023: Keynote Speakers Explore the EU Chips Act, Automotive Electronics, and Photonics Packaging
This episode features interviews that were recorded live at IMAPS DPC 2023.
First is an interview with CEA Leti’s Silvie Joly, who gave an industry coalition talk during the Global Business Council session, New Momentum in Semiconductors: Impact of Ecosystems, a European Case Study. Joly is the partnerships manager for 3D integration and packaging at CEA Leti. She provides key takeaways from her talk.
Next up is Basam Ziadah, who presented his keynote, Driving Adoption of Advanced IC Packaging in Automotive Applications. He talks about what drives more semiconductor devices in automotive applications. He describes the challenges we need to address to deliver advanced technology with the level of reliability required by the automotive industry, and how chiplet integration can be used.
Lastly, Françoise interviews Nicholas Harris, CEO of Lightmatter, who presented on extending Moore’s Law with photonics packaging. He explains why chiplets aren’t the panacea everyone thinks, of and how 3D integration using photonics packaging is the way forward to achieve performance at low power for artificial intelligence and high-performance computing.
Episode Guests
· Basam Ziadeh, General Motors
· Nicholas Harris, Lightmatter
IMAPS Device Packaging ConferenceInterconnects for Tomorrow’s Applications
Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.
Support the show
Become a sustaining member!
Like what you hear? Follow us on LinkedIn and Twitter
Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.
Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.