imaps dpc

At IMAPS DPC, Françoise von Trapp moderated a town hall discussion, DEI: It Takes a Village. The target audience was not HR or hiring managers, but the regular attendees who may be wondering what they can do to help create an atmosphere of equity and inclusion at their workplace. We asked the hard questions that people might be asking: Why should I care? Why do I need to use my pronouns? What can I do/say to have an impact on our company culture? 

 Panelists: 

• Francesca Domingo, EMD Group | Head of University Relations & Talent Strategy, EMD Group 
• Ann McKenna, Arizona State University, Fulton Schools of Engineering | Vice Dean for Strategic Advancement
• Rebeca Obregon-Jimenez, Avnet | SVP Strategic Business Engagements & Supplier Management
• Robin Stubenhofer, Kansas City National Security Campus (KCNSC) managed by Honeywell | VP of Engineering

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

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In 2021, there was a changing of the guard at the International Microelectronics and Packaging Society. In this episode, Françoise speaks with new IMAPS President, Beth Keser, and President-elect Erica Folk, about their vision for IMAPS going forward. 

Beth and Erica provide details on three major initiatives: One is to create awareness in the US Government and defense industry about the importance of packaging in the semiconductor industry. The second is to bring in more academics and students into the society. Students are the future of the microelectronics industry. Third, they want to update the IMAPS documentation to modernize the bylaws and rules that govern the organization. We also talked about the activities of the IMAPS Foundation. They are launching a competition to get universities excited. Learn more here. 

Contact our Speakers on LinkedIn

·      Beth Keser, IMAPS President

·      Erica Folk, IMAPS President-elect

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the show

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In addition to our 3D InCites Award Winners, we caught up with some of our members who had news and stories to share at IMAPS DPC, March 8-10, 2022. 

 In this episode, Françoise speaks with Bob Connor, of member company X-Celeprint, about the Micro Transfer Process (MTP) a massively parallel pick and place technology that has been around since 2007, but is starting to get traction new applications in the heterogeneous integration space. 

 Next, she speaks with Darby Davis of Gel-Pak, a Delphon Company, who explains the relationship between Delphon Industries and its subsidiary companies. Gel-pak is a different sort of advanced packaging. While they aren’t involved in building microelectronics, they are critical to the supply chain as they are used for packaging and handling fragile devices. They come to IMAPS DPC to learn about what’s happening in the industry to stay on top of their technology development. 

The episode wraps up with a conversation with Abul Nuruzzaman, Xperi Corporation, in which they unpack the elements of a recent two-pronged press release about a new license agreement with Micron, and a new brand for the Xperi IP business – Aediea.

Contact our Speakers on LinkedIn

·      Bob Conner, VP Business Development, X-Celeprint

·      Darby Davis, VP Sales, Delphon Industries

·      Abul Nuruzzaman, VP Marketing, Xperi Corporation

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the show

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

The topic of the 2022 IMAPs Global Business Council Spring Meeting, co-located with the IMAPS Device Packaging Conference, was Onshoring for the Department of Defense (DoD). Since the last time we visited the Onshoring packaging to the US question, the Chips Act has been passed, and now Congress is trying to decide how to appropriate the 52Billion in incentives.  

Simultaneously, the already-funded State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program has been launched to develop a sustainable business and operational model to provide the DoD with access to domestic sources of SOTA digital and radio frequency packaging. It’s believed that sustained access to SOTA packaging will foster significant system performance increases, which will enable military system modernization and support next-generation capabilities.

In this episode, we speak with Jim Will of Skywater Technology and John Lannon, of Micross AIT. Both presented as part of the GBC plenary session. We talk about how the $52Billion would best be appropriated. We also talk about the concerns that this might be just a temporary solution, and what the outcome will be if it’s not sustained. 
 
 We also speak with Keynote Speaker, Darrin Crum, Technical Lead of the SHIP Program, and Tom Smelker of Mercury Microsystems, the performer that provides the classified environment needed to keep the program secure. Crum and Smelker explain how the SHIP program works, who is involved, and how chiplets and other heterogeneous integration technologies can make it possible to quickly bring SOTA to the defense community. 

Contact Today's Speakers on LinkedIn: 

• James Will, SkyWater Technology - A&D BU Director
• Dr. John Lannon, Micross Advanced Interconnect Technology - General Manager
• Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
• Tom Smelker, Mercury Systems – VP& GM, Microsystems

To learn more, read Tom Smelker's blog post, Enabling a Trusted Domestic Microelectronics Ecosystem.

 

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the show

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

We presented the 2022 3D InCites Awards in person on March 10 at the IMAPs Device Packaging Conference. Rather than acceptance speeches, we carved out time throughout the week to interview some winners for the 3D InCites podcast. In this, the first of two episodes we speak with the following award winners and asked them to share their success stories with our listeners. 

First up, a conversation with EMD’s Jeff Catlin, about the company’s commitment to sustainable semiconductor manufacturing. EMD is our 2022 Sustainablity Award Winner. 

Next, you’ll hear from John Lannon of Micross AIT, about the company’s legacy of 3D IC technology development. Micross is the 3D InCites Devices manufacturer of the year. 

Craig Bishop, CTO of Deca, Process of the Year winner, talks about Gen 2. of Adaptive Patterning. He also share’s his personal story of how he came to be part of the advanced packaging industry. It all began with a conversation with his neighbor, Tim Olson, CEO of Deca…

Shelby Nelson, CTO of Mosaic Microsystems, winner of Start-up of the Year, share’s the company’s origin story as women-founded company, through its growth today. 

 ERS electronic GmbH is the 2022 Equipment Supplier of the Year, and Debbie Claire Sanchez joined us to talk about the highlights of the paper she presented on the company’s advances in thermal debonding. She also shared some of her back-story of working at Deca. 

This year’s Herb Reiter Design Tool Award went to Cadence. We spoke with John Park about the company’s first-of-its-kind comprehensive, high-capacity 3D-IC design platform. He also clarifies the difference between a SiP and a chiplet architecture from a design perspective. 

Raja Swaminathan gives an acceptance speech for the DEI Award, explains the role of a Sr. Fellow at AMD. He also talks about AMD’s 3D V-Cache, and explains what he means by True 3D. We continued the discussion of the different between a SiP package and a Chiplet package. 

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the show

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! It’s been two years since the event took place in person. In fact, it was the last event I attended before the world shut down – literally two weeks later. Even then, the buzz was about COVID 19, elbow bumping and hand sanitizing. Masks weren’t even a thing yet. It was also the last time we held the 3D InCites Awards Ceremony in person. Last year, we went virtual. So we thought it would be great to kick things off and generate some excitement by inviting Beth Keser, IMAPS new President, and Jim Haley, VP of Marketing, to talk about what’s in store for attendees. We talk about the programming, the exhibits, networking opportunities, the collaboration between 3D InCites and IMAPS to bring you future podcast episodes and more. 

Here's where you can learn more about what we discussed: 

 

·      IMAPS Device Packaging Conference Program and Registration 

·      IMAPS Golf Outing 

·      3D InCites Award Winners

·      Hike for DEI 

Email Françoise for DEI Sponsorship information or to sponsor a podcast episode 

Beth Keser, Ph.D. is a recognized global leader in the semiconductor packaging industry with over 24 years of experience. She received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 34 patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department in the Product Enablement Solutions Group.  Beth is currently IMAPS President and has taught a Professional Development Course on Fan-Out Wafer Level Packaging at conferences since 2015.
Connect with Beth Keser on LinkedIn 

James Haley is a passionate leader with cross functional experience in early adoptive and fortune 100 companies.  Background and experience range in bridging businesses from start up to commercial success.  Active areas of expertise business strategy, strategic marketing, product development and strategic selling in

IMAPS Device Packaging Conference
Interconnects for Tomorrow’s Applications

Disclaimer: This post contains affiliate links. If you make a purchase, I may receive a commission at no extra cost to you.

Support the show

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.