heterogeneous integration

The International Microelectronics and Packaging Society’s Device Packaging Conference (IMAPS DPC) celebrates its 20th year this year. The conference takes place March 19-21, in Fountain Hills, AZ. 

 In this episode, Françoise von Trapp speaks with Scott Hayes, General Chair, IMAPS DPC, and Amy Lujan, General Chair-Elect of IMAPS DPC about the history of this event, and what sets it apart from IMAPS annual Symposium. 

This year’s event will focus on heterogeneous integration and growth drivers for packaging, with speakers from companies like AMD, Intel, Facebook Reality Labs, and more. The General Business Council session will focus on Chips for America funding, doing business in China, and the significant growth of the U.S. semiconductor supply chain, particularly in Phoenix, AZ. 

 You’ll learn about the key applications driving technology advancements in autonomous vehicles, radar, and high-performance computing. During the panel discussion, you’ll learn about the next killer app and its potential impact of the semiconductor industry. 

Hayes and Lujan also discuss all the networking opportunities and fund raising activities that you can take part in. 

 Contact our Guests on LinkedIn

Scott Hayes, Technical Director, NXP Semiconductors 

Amy Lujan, Vice President, SavanSys

Registration for IMAPS DPC can be found here. You can also register for the Golf Tournament and Hike for DEI at the same time. 

 If you’d like to participate in the 3D InCites Member and Guest Event – the Backyard Olympics, sign up here. There is no charge to participate, and space is limited. 

 International Women’s Day is March 8th, and to celebrate, we’re partnering with SEMI to bring you an episode on how companies are fostering and implementing DEIB and allyship in their corporate culture. We’re looking for a few mentor/mentee pairs who are interested in sharing there story, as part of the episode. If you’d like to participate, drop me a line at francoise@3DinCites.com. Interviews must take place by February 23 to be included. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! 

 At ECTC 2023, which took place earlier this month, the password was hybrid bonding. In this episode, you’ll hear from our member companies that specialize in hybrid bonding solutions: Adeia, EV Group, and Onto Innovation. You’ll also hear about a novel die-to-wafer process technology from CEA Leti, and an alternative to Die-to-wafer hybrid bonding being developed by the UCLA CHIPS program.   

Thomas Uhrmann, Markus Wimplinger, and Dave Kirsch, EVGroup, talk about the company’s capabilities in supporting both wafer-to-wafer hybrid bonding, and the work being done at the Heterogeneous Integration Competency Center in Austria.  

Adeia’s Laura Mirkarimi and Abul Nuruzzaman, pioneers of hybrid bonding, help dispel some misconceptions about the commercialization of Die-to-wafer hybrid bonding. They talk about the advantages of investing in not only the technology license but the technology transfer. 

Monica Pau, Onto Innovation, talks about the events focused on hybrid bonding, but also some insights into glass core IC substrates, and Onto Innovation's capabilities in both. 

Emilie Bourjot, CEA-Leti, describes a novel self-assembly process that allows for improved alignment accuracy and increased throughput during die-to-wafer hybrid bonding. 

Subu Iyer, of UCLA CHIPS, offers a new approach to copper-to-copper thermocompression bonding that he says provides an alternative to die-to-wafer hybrid bonding. 

Next up on the 3D InCites Podcast: On July 6, Dave Thomas, of KLA’s SPTS division will talk about the advantages of plasma dicing for die-to-wafer hybrid bonding. That episode is sponsored by KLA. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

The 3D InCites community had 24 of its members who were either presenting, exhibiting, or both. This episode features conversations Françoise had with many of the participating members about the key takeaways they got from the event, as it relates to their company’s technology goals. 

Rozalia Beica and Venkata Mokkapati, AT&S talk about the important role advanced IC substrates have in today’s advanced microelectronics. They addressed questions about the lack of IC substrate manufacturing in the US, and how AT&S is positioned to help support that need. 

Ram Trichur, of Henkel Corporation accepted the Material Supplier of the Year 3D InCites Award and talked about changing materials requirements to support automotive electronics requirements. 

Ralph Zorberbier and Rolland Rettenmeier of Evatec talk about advancements in physical vapor deposition for fan-out wafer-level packaging, and thermal management solutions for HPC. They also talk about the traction fan-out panel level packaging is getting. 

David Levy, of Mosaic Microsystems, was at ECTC to learn about emerging applications that could benefit from the company’s thin glass handling solutions. 

 Stephan Schmidt, LPKF Laser, explains why glass is such an important topic right now in the microelectronics community and the role LPKF has played in solving glass challenges – such as forming through glass vias. 

Irving Wang, MRSI, talks about what he came to learn at ECTC 2023, and the current focus on hybrid bonding, and the role MRSI plays in die-to-wafer hybrid bonding. 

Garry Pycroft, Deca, sings the praises of ECTC, and what a great event it is. He also talks about the different segments of the market that Deca’s technologies serves. 

Curtis Zwenger, at Amkor Technology, shares the news about opening of the smartest OSAT factory in the OSAT world, located in Vietnam.  

Dave Thomas, KLA’s SPTS division, talks about all the information he gets out of ECTC, and how it relates to what SPTS is working on to support emerging technologies. 

 C.P. Hong and Vikas Gupta, from ASE Group, talk about the company’s new product announcement, FoCoS Bridge, and how it fits into the VIPack pillars. 

Debbie-Claire Sanchez, ERS Electronic, talks about the company’s efforts to build a portfolio around warpage, with the launching of its warpage metrology system. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

At IMAPS DPC, Françoise von Trapp moderated a town hall discussion, DEI: It Takes a Village. The target audience was not HR or hiring managers, but the regular attendees who may be wondering what they can do to help create an atmosphere of equity and inclusion at their workplace. We asked the hard questions that people might be asking: Why should I care? Why do I need to use my pronouns? What can I do/say to have an impact on our company culture? 

 Panelists: 

• Francesca Domingo, EMD Group | Head of University Relations & Talent Strategy, EMD Group 
• Ann McKenna, Arizona State University, Fulton Schools of Engineering | Vice Dean for Strategic Advancement
• Rebeca Obregon-Jimenez, Avnet | SVP Strategic Business Engagements & Supplier Management
• Robin Stubenhofer, Kansas City National Security Campus (KCNSC) managed by Honeywell | VP of Engineering

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

At the 2023 IMAPS Device Packaging Conference, there were a lot of discussions about chiplet technology, both in panel discussions and in general conversations. In this episode, we pulled together several interviews in an attempt to demystify and define chiplets, how they are produced and interconnected, what challenges the industry faces, and what we need to do to overcome them.  

You’ll hear from: 

•  Keith Felton, Siemens EDA 
• Chris Scanlan, Besi
• Choon Lee, JCET Group 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In This episode, Françoise von Trapp interviews some of the 2023 3D InCites Award Winners, to learn about the significant accomplishments they are being recognized for.  

 First is James Bear, TEL, who describes some of the company’s best practices that helped them secure the 2023 3D InCites Sustainability Award.

Engineer of the Year, Markus Leitgeb, AT&S, explains the concepts and advantages of the company’s Embedded Component Process (ECP), which he helped develop. 

Mark Gerber, ASE, winner of the Device Technology of the Year award for the VIPack™ Platform explains this six-pillar approach and the recent announcement of its fan-out package on package (FOPOP) technology. 

Eelco Bergman, of Saras Micro Devices, this year’s Start-up of the Year Award Winner, talks about the company’s team of industry experts, and the technology its developing heterogeneous integration technologies that will improve power efficiency for AI, high-performance computing, and data centers. 

 Thomas Uhrmann and Garrett Oakes of EV Group talk about the company’s breakthrough NanoCleave process that one the 3D InCites Process of the Year Award. This revolutionary IR laser process targets silicon carrier technology for 3D integration. 

Tim Olson and Robin Davis of Deca, winner of the SemiSister Award for DEI, talked about building DEI into Deca’s DNA, and what it’s like to establish a culture of DEI at a small company. 

Become a sustaining member!

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In 2021, there was a changing of the guard at the International Microelectronics and Packaging Society. In this episode, Françoise speaks with new IMAPS President, Beth Keser, and President-elect Erica Folk, about their vision for IMAPS going forward. 

Beth and Erica provide details on three major initiatives: One is to create awareness in the US Government and defense industry about the importance of packaging in the semiconductor industry. The second is to bring in more academics and students into the society. Students are the future of the microelectronics industry. Third, they want to update the IMAPS documentation to modernize the bylaws and rules that govern the organization. We also talked about the activities of the IMAPS Foundation. They are launching a competition to get universities excited. Learn more here. 

Contact our Speakers on LinkedIn

·      Beth Keser, IMAPS President

·      Erica Folk, IMAPS President-elect

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In addition to our 3D InCites Award Winners, we caught up with some of our members who had news and stories to share at IMAPS DPC, March 8-10, 2022. 

 In this episode, Françoise speaks with Bob Connor, of member company X-Celeprint, about the Micro Transfer Process (MTP) a massively parallel pick and place technology that has been around since 2007, but is starting to get traction new applications in the heterogeneous integration space. 

 Next, she speaks with Darby Davis of Gel-Pak, a Delphon Company, who explains the relationship between Delphon Industries and its subsidiary companies. Gel-pak is a different sort of advanced packaging. While they aren’t involved in building microelectronics, they are critical to the supply chain as they are used for packaging and handling fragile devices. They come to IMAPS DPC to learn about what’s happening in the industry to stay on top of their technology development. 

The episode wraps up with a conversation with Abul Nuruzzaman, Xperi Corporation, in which they unpack the elements of a recent two-pronged press release about a new license agreement with Micron, and a new brand for the Xperi IP business – Aediea.

Contact our Speakers on LinkedIn

·      Bob Conner, VP Business Development, X-Celeprint

·      Darby Davis, VP Sales, Delphon Industries

·      Abul Nuruzzaman, VP Marketing, Xperi Corporation

Become a sustaining member!

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

The topic of the 2022 IMAPs Global Business Council Spring Meeting, co-located with the IMAPS Device Packaging Conference, was Onshoring for the Department of Defense (DoD). Since the last time we visited the Onshoring packaging to the US question, the Chips Act has been passed, and now Congress is trying to decide how to appropriate the 52Billion in incentives.  

Simultaneously, the already-funded State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) program has been launched to develop a sustainable business and operational model to provide the DoD with access to domestic sources of SOTA digital and radio frequency packaging. It’s believed that sustained access to SOTA packaging will foster significant system performance increases, which will enable military system modernization and support next-generation capabilities.

In this episode, we speak with Jim Will of Skywater Technology and John Lannon, of Micross AIT. Both presented as part of the GBC plenary session. We talk about how the $52Billion would best be appropriated. We also talk about the concerns that this might be just a temporary solution, and what the outcome will be if it’s not sustained. 
 
 We also speak with Keynote Speaker, Darrin Crum, Technical Lead of the SHIP Program, and Tom Smelker of Mercury Microsystems, the performer that provides the classified environment needed to keep the program secure. Crum and Smelker explain how the SHIP program works, who is involved, and how chiplets and other heterogeneous integration technologies can make it possible to quickly bring SOTA to the defense community. 

Contact Today's Speakers on LinkedIn: 

• James Will, SkyWater Technology - A&D BU Director
• Dr. John Lannon, Micross Advanced Interconnect Technology - General Manager
• Darren J. Crum, Naval Surface Warfare Center, Crane Division - Technical Lead of the SHIP Program for OUSD(R&E) – Modernization Microelectronics
• Tom Smelker, Mercury Systems – VP& GM, Microsystems

To learn more, read Tom Smelker's blog post, Enabling a Trusted Domestic Microelectronics Ecosystem.

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

We presented the 2022 3D InCites Awards in person on March 10 at the IMAPs Device Packaging Conference. Rather than acceptance speeches, we carved out time throughout the week to interview some winners for the 3D InCites podcast. In this, the first of two episodes we speak with the following award winners and asked them to share their success stories with our listeners. 

First up, a conversation with EMD’s Jeff Catlin, about the company’s commitment to sustainable semiconductor manufacturing. EMD is our 2022 Sustainablity Award Winner. 

Next, you’ll hear from John Lannon of Micross AIT, about the company’s legacy of 3D IC technology development. Micross is the 3D InCites Devices manufacturer of the year. 

Craig Bishop, CTO of Deca, Process of the Year winner, talks about Gen 2. of Adaptive Patterning. He also share’s his personal story of how he came to be part of the advanced packaging industry. It all began with a conversation with his neighbor, Tim Olson, CEO of Deca…

Shelby Nelson, CTO of Mosaic Microsystems, winner of Start-up of the Year, share’s the company’s origin story as women-founded company, through its growth today. 

 ERS electronic GmbH is the 2022 Equipment Supplier of the Year, and Debbie Claire Sanchez joined us to talk about the highlights of the paper she presented on the company’s advances in thermal debonding. She also shared some of her back-story of working at Deca. 

This year’s Herb Reiter Design Tool Award went to Cadence. We spoke with John Park about the company’s first-of-its-kind comprehensive, high-capacity 3D-IC design platform. He also clarifies the difference between a SiP and a chiplet architecture from a design perspective. 

Raja Swaminathan gives an acceptance speech for the DEI Award, explains the role of a Sr. Fellow at AMD. He also talks about AMD’s 3D V-Cache, and explains what he means by True 3D. We continued the discussion of the different between a SiP package and a Chiplet package. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

IMAPS Device Packaging Conference 2022 takes place next week – March 8-10, here in our home state of Arizona, and we at 3D InCites are very excited! It’s been two years since the event took place in person. In fact, it was the last event I attended before the world shut down – literally two weeks later. Even then, the buzz was about COVID 19, elbow bumping and hand sanitizing. Masks weren’t even a thing yet. It was also the last time we held the 3D InCites Awards Ceremony in person. Last year, we went virtual. So we thought it would be great to kick things off and generate some excitement by inviting Beth Keser, IMAPS new President, and Jim Haley, VP of Marketing, to talk about what’s in store for attendees. We talk about the programming, the exhibits, networking opportunities, the collaboration between 3D InCites and IMAPS to bring you future podcast episodes and more. 

Here's where you can learn more about what we discussed: 

·      IMAPS Device Packaging Conference Program and Registration 

·      IMAPS Golf Outing 

·      3D InCites Award Winners

·      Hike for DEI 

Email Françoise for DEI Sponsorship information or to sponsor a podcast episode 

Beth Keser, Ph.D. is a recognized global leader in the semiconductor packaging industry with over 24 years of experience. She received her B.S. degree in Materials Science and Engineering from Cornell University and her Ph.D. from the University of Illinois at Urbana-Champaign. Beth’s excellence in developing revolutionary electronic packages for semiconductor devices has resulted in 34 patents and patents pending and over 50 publications in the semiconductor industry. Based in San Diego, Beth leads Intel’s Packaging & Systems Technology department in the Product Enablement Solutions Group.  Beth is currently IMAPS President and has taught a Professional Development Course on Fan-Out Wafer Level Packaging at conferences since 2015.
Connect with Beth Keser on LinkedIn 

James Haley is a passionate leader with cross functional experience in early adoptive and fortune 100 companies.  Background and experience range in bridging businesses from start up to commercial success.  Active areas of expertise business strategy, strategic marketing, product development and strategic selling in

Become a sustaining member!

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.