ectc 2023

This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! 

 At ECTC 2023, which took place earlier this month, the password was hybrid bonding. In this episode, you’ll hear from our member companies that specialize in hybrid bonding solutions: Adeia, EV Group, and Onto Innovation. You’ll also hear about a novel die-to-wafer process technology from CEA Leti, and an alternative to Die-to-wafer hybrid bonding being developed by the UCLA CHIPS program.   

Thomas Uhrmann, Markus Wimplinger, and Dave Kirsch, EVGroup, talk about the company’s capabilities in supporting both wafer-to-wafer hybrid bonding, and the work being done at the Heterogeneous Integration Competency Center in Austria.  

Adeia’s Laura Mirkarimi and Abul Nuruzzaman, pioneers of hybrid bonding, help dispel some misconceptions about the commercialization of Die-to-wafer hybrid bonding. They talk about the advantages of investing in not only the technology license but the technology transfer. 

Monica Pau, Onto Innovation, talks about the events focused on hybrid bonding, but also some insights into glass core IC substrates, and Onto Innovation's capabilities in both. 

Emilie Bourjot, CEA-Leti, describes a novel self-assembly process that allows for improved alignment accuracy and increased throughput during die-to-wafer hybrid bonding. 

Subu Iyer, of UCLA CHIPS, offers a new approach to copper-to-copper thermocompression bonding that he says provides an alternative to die-to-wafer hybrid bonding. 

Next up on the 3D InCites Podcast: On July 6, Dave Thomas, of KLA’s SPTS division will talk about the advantages of plasma dicing for die-to-wafer hybrid bonding. That episode is sponsored by KLA. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

The 3D InCites community had 24 of its members who were either presenting, exhibiting, or both. This episode features conversations Françoise had with many of the participating members about the key takeaways they got from the event, as it relates to their company’s technology goals. 

Rozalia Beica and Venkata Mokkapati, AT&S talk about the important role advanced IC substrates have in today’s advanced microelectronics. They addressed questions about the lack of IC substrate manufacturing in the US, and how AT&S is positioned to help support that need. 

Ram Trichur, of Henkel Corporation accepted the Material Supplier of the Year 3D InCites Award and talked about changing materials requirements to support automotive electronics requirements. 

Ralph Zorberbier and Rolland Rettenmeier of Evatec talk about advancements in physical vapor deposition for fan-out wafer-level packaging, and thermal management solutions for HPC. They also talk about the traction fan-out panel level packaging is getting. 

David Levy, of Mosaic Microsystems, was at ECTC to learn about emerging applications that could benefit from the company’s thin glass handling solutions. 

 Stephan Schmidt, LPKF Laser, explains why glass is such an important topic right now in the microelectronics community and the role LPKF has played in solving glass challenges – such as forming through glass vias. 

Irving Wang, MRSI, talks about what he came to learn at ECTC 2023, and the current focus on hybrid bonding, and the role MRSI plays in die-to-wafer hybrid bonding. 

Garry Pycroft, Deca, sings the praises of ECTC, and what a great event it is. He also talks about the different segments of the market that Deca’s technologies serves. 

Curtis Zwenger, at Amkor Technology, shares the news about opening of the smartest OSAT factory in the OSAT world, located in Vietnam.  

Dave Thomas, KLA’s SPTS division, talks about all the information he gets out of ECTC, and how it relates to what SPTS is working on to support emerging technologies. 

 C.P. Hong and Vikas Gupta, from ASE Group, talk about the company’s new product announcement, FoCoS Bridge, and how it fits into the VIPack pillars. 

Debbie-Claire Sanchez, ERS Electronic, talks about the company’s efforts to build a portfolio around warpage, with the launching of its warpage metrology system. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode, recorded live at ECTC 2023, Françoise interviews some of the key speakers about the hot topics of the week: Quantum computing, the Chips and Science Act, and workforce development. Additionally, she speaks with the winner of the first-ever, IEEE EPS William Chen Distinguished Service Award. The episode concludes with a conversation with the event organizers about changes and future plans. 

Keynote speaker, Mike Manfra, physics professor at Purdue University, and Scientific Director, Microsoft Quantum Lab West Lafayette, talks about quantum computing — what it is, why we need it, and what challenges and opportunities exist from the microelectronics advanced packaging community to bring it into manufacturing.  

Dick Otte, Promex, and Joshua Dillon, Marvell, talk about the key takeaways from the Chips Act Special Session – Advanced Packaging in North America, building the ecosystem. 

Kim Yess, Brewer Science, talks about the Diversity and Career Growth Panel, and the key takeaways discussed by the panel on diversifying our workforce to meet National needs as outlined by the CHIPS Act Initiative. 

Shaw Fong Wong talks about what inspires him to volunteer his time to the EPS Society. 

 Ibrahim Guven and Florian Herrault wrap up the episode with a look at the success of this year’s format changes and future plans for ECTC 2024 and beyond. 

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.