glass substrates

This episode of the 3D InCites podcast is brought to you by our sustaining members. Shout out to our first official sustaining members Lori McDonald of Deca, and Brian Schieman, of IMAPS. Thanks for helping us continue to create great content! 

 At ECTC 2023, which took place earlier this month, the password was hybrid bonding. In this episode, you’ll hear from our member companies that specialize in hybrid bonding solutions: Adeia, EV Group, and Onto Innovation. You’ll also hear about a novel die-to-wafer process technology from CEA Leti, and an alternative to Die-to-wafer hybrid bonding being developed by the UCLA CHIPS program.   

Thomas Uhrmann, Markus Wimplinger, and Dave Kirsch, EVGroup, talk about the company’s capabilities in supporting both wafer-to-wafer hybrid bonding, and the work being done at the Heterogeneous Integration Competency Center in Austria.  

Adeia’s Laura Mirkarimi and Abul Nuruzzaman, pioneers of hybrid bonding, help dispel some misconceptions about the commercialization of Die-to-wafer hybrid bonding. They talk about the advantages of investing in not only the technology license but the technology transfer. 

Monica Pau, Onto Innovation, talks about the events focused on hybrid bonding, but also some insights into glass core IC substrates, and Onto Innovation's capabilities in both. 

Emilie Bourjot, CEA-Leti, describes a novel self-assembly process that allows for improved alignment accuracy and increased throughput during die-to-wafer hybrid bonding. 

Subu Iyer, of UCLA CHIPS, offers a new approach to copper-to-copper thermocompression bonding that he says provides an alternative to die-to-wafer hybrid bonding. 

Next up on the 3D InCites Podcast: On July 6, Dave Thomas, of KLA’s SPTS division will talk about the advantages of plasma dicing for die-to-wafer hybrid bonding. That episode is sponsored by KLA. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

In this episode, Françoise von Trapp holds impromptu interviews with 3D InCites members who attended, exhibited, and/or presented at the 2023 IMAPS DPC in March.  Topics of discussion include: Using AI in microelectronics manufacturing,
how front-end processes are finding their way into the back-end, updates on glass substrates, capillary underfill advancements, dealing with wafer warpage,  and advanced substrates and standards on panel sizes.   
 
Contact our Guests
Keith Felton, Siemens EDA, summarizes the presentation he gave on how to put AI, Machine Learning, and Deep learning to work in the semiconductor manufacturing environment. 

Emerald Greig, PTW Group,  explains PTW Group’s mission to become the go-to company for legacy support.  Emerald’s daughter recently appeared in the latest episode of Roadtrip Nation, Chip In, in which three young people searching for careers explore the works of microelectronics. 

Jim Straus of ACM Research shares feedback from the IMAPS attendee perspective. It was his first time at the event, and he shared some of his takeaways from the sessions he attended, particularly in the area of glass substrates. 

Ken Araujo of Namics talks about advancements in liquid capillary underfill, driven by cost as well as tightening specifications of advanced packaging applications. 

 Debbie Claire-Sanchez, of ERS Electronic GmbH talks about the company’s ongoing research to address wafer warpage issues. 

 Keith Best, Onto Innovation, talks about the ongoing debate over advanced IC substrates and standardization on panel size. 

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Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.

It’s no secret that semiconductors are very much a male-dominated industry. In fact, according to Zippia, only 10.7% of engineers working in the semiconductor industry are women. And according to Deloitte and Touche’s Women in the Workplace, women are still vastly underrepresented at all levels of management. In this episode, Françoise von Trapp talks with Christine Whitman, a semiconductor executive who has broken through these barriers. She’s the chairman and CEO of our member company. Mosaic Microsystems.

In this episode, Christine shares her origin story. She talks about what inspired her to pursue a career in semiconductors, and the career path she took that resulted in her buying her first company. A self-described serial entrepreneur, she talks about her passion for materials science, what she looks for when investing in a start-up, and what led her to found Mosaic Microsystems. She also shares her vision for the future, and advice for women looking to shatter the glass ceiling. 

About Mosaic Microsystems

Mosaic is pioneering thin glass for packaging and interposer applications in fields ranging from millimeter-wave communications to artificial intelligence and photonics. Thin glass has outstanding mechanical and electrical properties for today’s packaging applications, but adoption has been slow due to its fragility and flexibility. Mosaic’s Viaffirm handling solution eliminates these roadblocks by making thin glass compatible with standard semiconductor processes. Viaffirm also provides a platform for through glass vias and void-free via fill, enabling glass-based interposers with capabilities normally reserved for silicon.

Learn more about Christine Whitman here. 

Become a sustaining member!

Like what you hear? Follow us on LinkedIn and Twitter

Interested in reaching a qualified audience of microelectronics industry decision-makers? Invest in host-read advertisements, and promote your company in upcoming episodes. Contact Françoise von Trapp to learn more.

Interested in becoming a sponsor of the 3D InCites Podcast? Check out our 2023 Media Kit. Learn more about the 3D InCites Community and how you can become more involved.